About Us

TransSiP's patent portfolio builds on a foundation of innovation in the area of More-than-Moore (MtM) technologies.

Using advanced 3D heterogeneous (active and passive) embedded system-in-package designs, TransSiP's MtM technologies range from applications of micro-metamaterials in semiconductor packaging to breakthroughs in DC-DC conversion solutions for noise-sensitive systems/subsystems. These products and technologies offer the potential for significant increases in battery life and performance improvements in wearable/portable and IoT microsystems.

 
 
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TransSiP IP and Products enable

  • custom metamaterials solutions for enhanced dielectric performance

  • 3D / Faraday Cage-in-package shielding

  • DC-DC power supply noise reduction/conditioning

  • significant improvements in autonomy and range of portable/wearable systems

  • significant reductions in device volume

in microelectronic circuits and system-in-package devices.