Desmond Wong ACE Innovator of the Year Finalist

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The ACE (Annual Creativity in Electronics) Awards, in partnership with EE Times and EDN, showcase the best of the best in today's electronics industry, including the hottest new products, start-up companies, design teams, executives, and more. ACE celebrates the promise of new talent and innovation, as well as paying tribute to the lifetime achievements of a top industry veteran whose contributions have had a demonstrable impact on technological, business, and cultural advancements in the world.

Wong is a recognized pioneer in the field of 3D system-in-package heterogeneous integration for complex RF devices, involving embedding of both active and passive components in an organic polymer substrate. TransSiP was founded by Wong in 2014 as it became clear that the limitations of the planar model epitomized by Moore’s Law were not going to address the emerging possibilities presented by what is now known as “More than Moore” (MtM): the diversification and increasingly non-digital content of electronic devices. As a trained RF engineer, Wong had recognized the potential the system-in-package approach offered to non-linear analog systems and functions, in particular the use of parasitics in a microminiaturized, tightly controlled interconnect structure to achieve “better than book” performance.

These concepts had been field-proven in award-winning designs, including Telit’s Jupiter SE880 GPS module, so why not take it to the next level?

What emerged was the “Organic Fab” concept. In a break with the planar paradigm of silicon mounted on chip carriers mounted on printed circuit boards, Wong’s “Organic Fab” integrates components and interconnects in a large area organic substrate, combining the “better than book” potential of SiP packaging with the economies of printed circuit production. In partnership with a packaging and printed circuit manufacturing expert and having ready access to the third dimension through the use of co-laminated anylayer via and embedding processes, Wong was able not only to take a new approach to microsystems packaging, but also develop a unique collaborative workspace. His partner was based in Europe, his production sources in the US and Asia, his patent advisor in the UK, and his research laboratory in Southern California. What has emerged is a vital, virtual company, innovative and potentially game-changing products and a growing patent estate covering various aspects of the MtM opportunity.

The ACE nomination reflects Wong’s discovery and identification of the role switching noise jitter (SNJ) plays in the chaotic component of switched-mode DC-DC conversion supply bias noise, and his invention of TransSiP’s patent-pending JC™ circuit topology. The process involved development of an innovative analytical methodology using Tektronix’ DPX® real-time spectral histogram analysis, and JC™ conditions SNJ to the point where highly efficient pulse-frequency modulated (PFM) type DC-DC converters can replace linear regulators (LDO) in noise-sensitive applications. Occupying less than 5mm2 of board space, TransSiP’s Harmony JC SiP can be used with a range of PFM-type DC-DC converters, bringing very low (<500nA) quiescent current and conversion efficiencies from 80 - 93% throughout the load profiles required by portable, wearable, UAV /remote and IoT applications.

Winners will be announced at the ACE Awards ceremony which will be held at San Jose Convention Center in San Jose, CA on Wednesday, December 7 2016 in conjunction with ESC Silicon Valley.

William Burr