Form a Faraday Cage around the sensitive components, and make it very, very small.
This is what TransSiP’s patent-pending Trans-SHIELD™ technology does.
How it works
Depending on the topology of the circuit needing shielding, TransSiP's TransSHIELD™ technology forms micron-scale physical or "virtual" Faraday Cages inside a specially designed interposer around sensitive components or circuit functional blocks.
TransSHIELD™ does this by creating a 6-sided equipotential barrier formed by a ground/reference plane within the active circuit carrier, vias within the carrier and the TransSHIELD™ interposer, and plated or semi-plated cavities within the interposer itself.